Diamond Thinning Pad
The diamond thinning pad uses a spray-dried, self-made diamond cluster abrasive. The abrasive is mixed and dispersed with binders, additives, fillers, and other components in a specific ratio to form a uniform slurry. Through precise coating and micro-replication transfer techniques, an array of abrasive block structures is formed on the surface of the substrate. Used in conjunction with a flat grinding machine, it is suitable for thinning silicon carbide substrates, glass, ceramics, and similar materials. It provides a consistently smooth grinding surface, high grinding efficiency, and long service life.
